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Wave Soldering Process Parameters
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Wave Soldering Process Parameters

By: nikki.r

Wave soldering process is one of the most important process in manufacturing the printed circuit boards for the electrical and electronic purposes. Wave soldering process comprises of several other process like thermal profiling, reflow profiling and wave solder optimization. These processes come together to execute the successful wave soldering operation for the printed circuit board manufacturing companies. Like every other technical process this wave soldering process, too is dependent on various parameters for its successful completion. Different parameters determine the performance of any wave solder process, and at the same time the quality of the product manufactured by the process. So it becomes quite critical for the process engineers to monitor the wave solder process parameters very carefully. The parameters described here are the most important parameters in manufacturing the quality printed circuit boards for the electrical and electronic industries.

The parameters which determine the product quality are described below. Monitoring these could yield you greater profits in your business of printed circuit board manufacturing. These parameters includes the following

1.) Preheating

The wave soldering process preheating is the rise in the temperature of the board; it should be kept up to 45°C. This too should be maintained with a slope of 2 °C/Sec. This all should be done at the time when the soldering temperature is 85°C. Maintaining the preheating phenomenon could be used effectively in bringing the consistency in the quality of the product manufactured by you.

2.) Wetting time

The time between the first contact of the parts to be soldered and the solder is generally termed as the wetting time, in wave soldering process. This wetting time includes the time at which the solder starts to solidify. This helps a lot in maintaining the proper time period for a perfect solder, and hence could be highly productive for you.

3.) Dwell time
Dwell time for the wave solder process is pretty similar to the wetting time. It is the time between the first contact of the parts which are to be soldered and the solder, and the last moment of contact with the solder. In order to have a productive wave soldering process the dwell time for the wave soldering process should be between 2-4 seconds.
4.) Wave Soldering time

The wave soldering time is defined as the time between the actual contact of board with the solder and the onset of the solder solidification. This time could be 5-10 sec more than the dwell time. It is also a determining factor for the quality of the printed circuit boards hence should be watched pretty carefully.
5.) Solidification time:
Solidification time could be understood as the time taken by the solder to cool down at the base of the printed circuit boards.
6.) Cooling time:

Cooling time is the time taken for the forced cooling required when the solder temperature increases in some areas. Forced cooling is required to maintain the quality of the board and to save it from the after affects of the rise is temperature from some critical areas.

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Wave solder profiling process could be made quite easy and productive using the wave solder optimizer. The information provided by www.swpc.co.il concerning the optimization of wave soldering process could lead you to achieve a more productive and cost efficient results from the wave soldering process.

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